Under different test conditions that would generate a temperature rise much greater than 55°C, it is likely that the improvement would be even more pronounced. Key features: Wicks easily into tight spaces, 8-hour work life. Epic 0154 is a low-temperature heat cure, thermally conductive epoxy potting compound for electrical components. As a result, heat is dissipated within the enclosure and rapidly conducted to the heat sink, which has enabled substantial size and weight reductions of the finished component. The normal potting compound was only 110°C but the potting compound that was five times more thermally conductive was only 113°C. Despite their high filler content, they exhibit good flow properties with low viscosity. It is a low viscosity alternative to ER2220 system which is ideal for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is … Key features: Resistant to high temperatures, adheres to dissimilar materials, and self-leveling. 85 D/Black. 832TC Thermally Conductive Epoxy, Potting and Encapsulating Compound Container Format Change PCN Tracking Number: 001-1601-4 Notification Date: 22 January 2016 PCN Effective Date: 22 January 2016 Author: Michel Hachey, Ph.D. Summary: The tall, narrow-mouth, 1 L containers used for the 832TC epoxy made the product difficult to stir and de-air, which lead to … One key challenge in developing these types of components is to manage the heat generated by smaller, high-power devices like on-board battery chargers, power inverters and converters, and electric machines. Available in pre-mixed and degassed frozen syringes or 2-part kits. In order to effectively cool a component, a good physical contact must be formed between the component and the heat sink. Pigmented black for excellent thermal absorption and emission. Technical Documents × SDS SilCool* TIA216G Thermally Conductive Silicone Rubber Product Literature × Download All. We are a N/A. thermally conductive potting compound. UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. 50-2366FR is a thermally conductive polyurethane potting compound. Download Technical Data View Product Literature. Power was then applied, and the temperature was monitored until the inductor temperature stabilized. The material meets NASA’s outgassing requirements, is resistant to solvents and chemicals, and is considered non-hazardous per D.O.T. Rigid and wear resistant, epoxies are the strongest of the potting compounds. Choose from our selection of thermally conductive epoxies, including heat-transfer potting compounds, epoxy potting compounds, and more. This rapid temperature recovery means that heat is dissipated quickly and components will spend less time at elevated temperatures, thus increasing the lifetime of the components. 505-06 FR. A flowable and electrically isolating epoxy, 5316 was designed specifically for underfilling, staking, and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. 100:100. Figure 1 shows thermal conductivity versus viscosity of LORD silicone materials as compared to various competitor products. A major challenge for engineers is finding cost-effective Thermally Conductive Potting Compounds for medium to large potting applications. Equal mix blush free potting compound pending UL approval. Thanks to new thermally conductive silicone based compound call CoolMag™ to provide an excellent mechanically and thermally well connected critical components to heat-sink or cool plate. Formulated to draw heat away from sensitive electronic components, these potting compounds have higher thermal conductivity than standard potting compounds. 505-07 A/B. Salem, NH 03079. A pre-mixed, degassed, tested and frozen epoxy. 5 hrs/ 3 hrs @ 65°C. Thermal conductivity of a typical unfilled epoxy system has a very low value of 0.14 W/(m•K). Electrolube have a range of specialist epoxy, polyurethane and silicone resins which have been … With the non-conductive silicone, Thermoset SC-400 encapsulant, nearly two hours was required to reach steady state, whereas a stable temperature was achieved in less than 20 minutes for CoolTherm SC-320 and SC-324 encapsulants. Also, most potting compounds create too much heat when curing in large mass sizes. regulations. 16,000 cps. LORD CoolTherm SC-305, SC-309, SC-320, and SC-324 Thermally Conductive Silicone Encapsulant are filled silicone potting materials with progressively higher thermal conductivities of 0.7, 1.0, 3.0, and 4.0 W/m∙K, respectively. These ultra-temperature adhesives combine Cotronics ® ’ unique polymer system and special thermally conductive fillers to provide continuous service up to 340°C. 3000°F Highly Thermally Conductive, Potting Compound: Durapot™ 810 Alumina based, thermally conductive potting compound and adhesive developed to provide excellent electrical resistance at high temperature and improved thermal conductivity for high power applications. Featuring a high glass transition temperature of 200-210°C, it resists temperatures up to 550°F. A black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. Ability to withstand high temperatures, weather, lubricants, water, etc. Thermally speaking, the potting material acts like a heat insulator. An electrically isolating material, 5308 was designed specifically for underfilling, staking and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. Key Features: The material cures at room temperature, is low viscosity, has 1.38 W/mK thermal conductivity. The aluminum cooling plate was connected to a temperature-controlled liquid bath; each inductor was tested at coolant temperature set points of 25°C, and the typical automotive coolant temperature of 50°C. Thermally conductive potting compounds are resins designed to encapsulate components or ‘pot’ the entire PCB unit, dissipating heat away from the electronic components and in the process offering additional protection from environmental elements such as water or chemicals. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics. Five different LORD silicone potting materials were used in this study. Even the moderately conductive silicones, CoolTherm SC-305 and SC-309 encapsulants at 0.7 and 1.0 W/m∙K, respectively, provided significant improvements. Two part dual cure general potting … The cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. diversified technology and manufacturing company developing highly reliable adhesives, coatings, motion management devices, and sensing technologies that significantly reduce risk and improve product performance. Epic 0154 also boasts a medium … UV 9052 A/B. 5108 is a pre-mixed, degassed, tested and frozen epoxy. Many of the commercially available high performance products are not viable options due to the cost that they add to the electronic devices. 5336 is supplied in frozen syringes. A one-part, black, electrically isolating epoxy compound specifically designed for potting and sealing electronic components. Epic 0154 features good electrical properties, minimal settling characteristics and good heat transfer in a single component epoxy. Appli-Thane 7125 has low thermal conductivity. The potting compound fills the component enclosure entirely, leaving no air gaps. Inductors were potted in custommade aluminum cooling plates fitted with liquid inlet and outlet ports for connection to an external circulating fluid bath. Similarly, the equilibration time was also dramatically reduced with the higher thermally conductive materials (see Figure 7). Key features: Low viscosity urethane, self-leveling, D.O.T. (For more information on this topic please access our white paper, “How Proper Application of Thermally Conductive Materials Will Improve Motor Power Density.” In this white paper, we present the results of another study on the ability of LORD thermally conductive silicone materials to rapidly and effectively remove heat from high-power inductors. Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. Thermally conductive epoxy encapsulating and potting compound. During each thermal test, the temperatures of the inductor and cooling plate were recorded using an Omega Soft data logger. This material is also environmentally friendly and considered non‐hazardous per D.O.T. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies. Pre-mixed, degassed, tested, and frozen polyurethane adhesive. 5108 is a self-leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. Release Date: 10/10/2019. 60 A/Gray. Delivered to your inbox once a month. 5308 has a 1.26 W/mK thermal conductivity. Thermally Conductive Epoxy Encapsulating & Potting Compound 832TC Technical Data Sheet Description The 832TC Thermally Conductive Epoxy, Encapsulating and Potting Compound is an electric grade epoxy. regulations. A key differentiating property of LORD thermally conductive silicone materials is their low viscosity compared to competitor materials with similar thermal conductivity. … Applications for 0126 … This key property can be increased by adding metallic or ceramic fillers to the adhesive formulation. Typical … Product: Supreme 121AO. Epic 0126 is a thermally conductive potting compound and/or adhesive for electrical components featuring good electrical properties, minimum settling characteristics and good heat transfer in a single component epoxy. The average temperature rise with Thermoset SC-400 encapsulant was about 55°C, and the average rise for the most thermally conductive materials, CoolTherm SC-320 and SC-324 encapsulants, was less than 10°C. / 1 877 275-5673, Semiconductor Packaging and Circuit Assembly, How Proper Application of Thermally Conductive Materials Will Improve Motor Power Density. The potting compound fills the component enclosure entirely, leaving no air gaps. Currently, there is a strong trend toward the electrification of vehicles in the transportation industry, including automobiles, buses, trains, off-road vehicles, watercraft, and aircraft. For a comparison discussion of material chemistries, see our FAQ, The Pros and Cons of Epoxies, Urethanes, and Silicon Adhesives. SilCool TIA216G is a 2-component, thermally conductive potting material used primarily on complex thermal interface designs. LORD ThermosetTM SC-400 Silicone Encapsulant is a clear, soft gel with low thermal conductivity (0.1 W/m∙K) used for potting sensitive electronics where high dielectric strength and very low mechanical stress are desired. Technical data sheets for all commercial products can be found using the search bar at the top of this page or here. Appli-Tec offers high-performance potting compounds specifically designed for potting, staking, and encapsulating electronics, power supplies, coils, and transformers. Features and Benefits. M-F: Engineers, constructing owners, and constructors can advantage Epoxy potting compound working with this material applied in precast sandwiched wall panels. A black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. By nature, epoxy and polyurethanes are electrically insulative; the degree varies based on the specific formulation. ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. Electrolube have a range of specialist epoxy, polyurethane and silicone resins which have been … Use of thermally conductive compound providing low stress solution is the key. Our rigorously tested adhesive products solve the challenges associated with advanced potting and encapsulation applications including: All Appli-Tec potting compounds come pre-tested, pre-mixed and pre-packaged in sizes ranging from 1cc – 30cc for hand dispense syringes to 3cc – 55cc for pneumatic dispensing. The equilibration time was chosen at the point when the temperature reached steady state (no further temperature increase took place), and the reported temperature rise was calculated as the final temperature of the inductor minus the initial temperature. The inductors used in this study were made from Micrometals T400-61D high-temperature, magneticpowder toroid cores wrapped with 62 turns of 10-gauge insulated copper wire, which yield about 500 μH inductance at load. Thermally conductive potting compounds are proving to be an ideal method for rapidly and effectively conducting heat away from power components to the heat sink. 3200°F Electrically Resistant Coating: Durapot™ 820 is a 3200°F, one component paint and … Because the surfaces of both aren’t absolutely smooth at the microscopic level, tiny gaps exist – thus reducing the effectiveness of the contact area. With a Shore A hardness of 70, the soft urethane material provides resistance to vibration, as well as low shrinkage, for minimal stress on components during cure. The average temperature rise and equilibration time data are summarized in Figures 6 and 7. Provides best-in-class thermal conductivity for applications requiring aggressive heat dissipation of components. 25,000 cps. The other factor not … Convenient mix ratios; UL94 V-0 and UL 746A grades available; Thermally conductive options available; Low exotherm; Excellent dielectric properties; Wide service temperature range ; … Pre-mixed, degassed, tested and frozen polyurethane adhesive. For the thermal tests, each inductor was connected to a Manzanita Micro PFC40X-188 charger passing 9.3 kW and 40 A at 240V input with 0.98 power factor. Currently, there is a strong trend toward the electrification of vehicles in the transportation industry, including automobiles, buses, trains, off-road vehicles, watercraft, and aircraft. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. Our epoxy potting compound portfolio includes many functional specialties including flame retardancy, thermal conductivity, optical clarity, and dimensional stability. Thermally conductive potting compounds are proving to be an ideal method for rapidly and effectively conducting heat away from power components to the heat sink. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions. The cured resin is resistant to a wide or cycling temperature range making it an ideal choice for applications where thermal shock is a potential risk to the electronics, while it is also flame retardant to … Parker Chomerics THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form in- place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. SilCool* TIA216G Thermally Conductive Silicone Rubber. Whether you need a quote or you have questions about material availability, we can help. This black, two-part epoxy provides superior shock insulation and impact … Thermally Conductive PU Potting Compound -- 20-2366FR from Epoxies Etc... 20-2366 FR is a new thermally conductive polyurethane potting compound. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on … Thermally conductive potting compounds are resins designed to encapsulate components or ‘pot’ the entire PCB unit, dissipating heat away from the electronic components and in the process offering additional protection from environmental elements such as water or chemicals. RoHS compliant. Dramatic reductions in both temperature rise and equilibration time are observed for inductors potted with thermally conductive materials (see Figure 6). WO2002040589A1 - Thermally conductive casting compound - Google Patents Thermally conductive casting compound Download PDF Info Publication number WO2002040589A1. Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures. Thermally conductive adhesives serve an additional purpose as well. non-hazardous, transparent, and flexible. An optically clear, low viscosity, electrically isolating epoxy compound, 5051 bonds well to most substrates such as metals, glass, ceramics, and most plastics. The cooling plate and inductor temperatures were allowed to stabilize with no power. Will cure in deep sections. The five different materials were used to pot three inductors with each material, resulting in a total of 15 potted inductors. 45,000 cps. They are also easier to degas, meaning that parts can be potted that are essentially voidfree if a vacuum potting process is used. 10 min @ 177°C. A pre-mixed, degassed, tested and frozen epoxy, 5316 is also available in 2-part room temperature stable kits. 45 min/ 24 hrs @ 25°C. Duralco ® conductive Adhesives … The material is free-flowing, making it ideal for potting and underfill applications. Key features: Self-leveling, injectable; cures to a semi-flexible material with relatively low modulus and very low Tg. With more than 3,100 employees in 26 countries, 19 manufacturing facilities and 10 R&D centers worldwide, we're there for our customers. A second thermocouple was attached to the exterior of the cooling plate to monitor temperature changes during the test; however, the temperature rise of the cooling plate was less than 2°C even in the most extreme cases and, accordingly, will not be considered further. Plus a little humor too. Long work and/or pot life for robotic applications. thermally conductive potting compound wholesale, buy thermally conductive potting compound from 40 thermally conductive potting compound suppliers from China. The data show that both the inductor temperature rise and the equilibration time are independent of the coolant temperature, as the data at 25°C and 50°C are nearly superimposable and within the test variation. Volume resistivity for the materials listed is greater than 1×1014. 100:100 . Cotronics ® Duralco ® Thermally Conductive Adhesives and potting compounds provide the heat dissipation required for many High Temperature Electronic and Industrial applications. Figure 5 shows a representative plot for an inductor potted with Thermoset SC-400 encapsulant with the parameters indicated. The cost difference between the two systems was 20%. Key features: High Tg, low shrinkage, flowable, and 3-hour pot life. In stock and ready to ship. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. How do you protect sensitive electronics against overheating? All thermally conductive potting compound wholesalers & thermally conductive potting compound manufacturers come from members. TIA222G Thermally Conductive … Appli-Tec, Cryo-Pac, Appli-Thane, Appli-Pac and Car-Pac are all registered trademarks of Appli-Tec, Inc. Site by cre8d / Huff Industrial Marketing, A full range of adhesive materials to suit your potting application, Appli-Tec’s Ongoing Response to COVID-19 —, The Pros and Cons of Epoxies, Urethanes, and Silicon Adhesives, High thermal conductivity to dissipate heat. Each of the 15 inductors were tested at least one time, and several of the inductors were tested multiple times to determine repeatability. Low viscosity thermally conductive two part silicone. 7 Industrial Way, Unit 1 100 Percent solids. Before potting, each inductor was fitted with a thermocouple to measure its temperature during the test. Formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. It is better than air so it does help, but then use the less expensive normal potting compounds. We doesn't provide thermally conductive potting compound products or service, please contact them directly and verify their companies info carefully. This flexible system is designed for low stress on sensitive components during and after cure. Proper thermal management is essential for developing power electronics that are smaller and lighter, and smaller and lighter means higher power density. The trend is towards smaller, lighter, and less expensive components that will save space and reduce costs while boosting power efficiency. The location of the thermocouple corresponds to the hottest location in the inductor as judged qualitatively from a thermal camera image of an unpotted inductor under load. With strong structural integrity, this thermally conductive epoxy compound offers long-lasting, reliable performance. Use them to encase electronic assemblies for protection from dust, chemicals, moisture, mechanical shock, and vibration. Due to its high thermal conductivity, it protects circuits, by reducing the risk of heat … These materials are currently being used in numerous applications to protect sensitive electronic components from excess heat, including LED driver electronics, on-board chargers and inverters for electric vehicles, and electric motor stators. Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. 82 D/Black. High thermal conductivity, ionically clean, flexible, low stress solution for large die The complete set-up is shown in Figure 4. Error bars are plus and minus one standard deviation of the data, which includes part-to-part variation and repeatability. For example, we have demonstrated substantial temperature reductions and improved power output using LORD CoolTherm® SC-320 Thermally Conductive Silicone Encapsulant to pot the end windings of electric motors. It uses high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This property mix is achieved thanks to minimal thixotropic or pseudoplastic behavior, reducing the risk of air bubbles. Our lowest viscosity urethane product, Appli-Thane 7125 is ideal for potting and encapsulation of advanced electronic assemblies. Power at the inductor was 30W. The material passes NASA’s outgassing requirements and provides strain relief for many bonding applications where high thermal conductivity isn’t required. The type of filler, concentration of particles, their size and shape will determine the thermal conductivity of the product. Epic 0154 has excellent shelf-life stability for a one-component heat cure epoxy resin. • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs LEADER IN THERMAL MANAGEMENT: DESIGN, INNOVATION AND MATERIALS TECHNICAL BULLETIN 62 CHO-THERM® 1641 & 1642 Thermally Conductive Silicone Compounds CHO-THERM® 1641 CHO-THERM 1641 compound is a one-component thermally conductive … Appli-Tec develops and manufactures precision mixed adhesives for engineers who need consistent, repeatable results - every time. This flexible … The lower viscosity allows LORD materials to flow and fill voids more readily while providing excellent thermal conductivity. The trend is towards smaller, lighter, and less expensive components that will save space and reduce costs … LORD Corporation has been supplying thermally conductive, electrically insulating potting materials to the power electronics industry for over a decade, and recently, we have been testing the effectiveness of using potting compounds with high thermal conductivity to dissipate heat in high-power applications. One set of potted inductors is shown in Figure 2. 832TC potting and encapsulating compound is a thermally conductive, black, two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is important to note that the variation becomes much smaller as the thermal conductivity increases due to the more effective thermal connection to the aluminum cooling plate. Each adhesive listed can be modified to suit your application: Ideal for aerospace applications as it meets NASA’s outgassing requirements. Potted components de-air easily. Potting Compounds Conformal Coatings & Conductive Adhesives Electronics - Potting Compounds Conformal Coatings & Conductive adhesives ECT Adhesives, in conjunction with our global manufacturing partners, offer a complete range of Potting Compounds, Conformal Caotings, Electrically and Thermally Conductive adhesives to meet all your requirements in the … 8:00am–5:00pm EST As a result, heat is dissipated within the enclosure and rapidly conducted to the heat sink, WACKER’s thermally conductive silicone encapsulants and potting compounds are optimized for bubble-free encapsulation. This … Key features: Electrically isolating, 1.48 W/mK thermal conductivity, low shrinkage, and flowable. This product is designed for applications where thermal management is a concern. The material is ideal for applications requiring a self-leveling room temperature cure and better than average thermal conductivity. 5336 is supplied in frozen syringes. (See Figure 3.) Long ranges and/or high horsepower require high power density from their electrical components such as batteries, motors and generators, and the power electronics needed for operation. All of the materials are electrically insulating with high dielectric strength and excellent high-temperature stability. They can be either electrically conductive or electrically insulative, as illustrated in the diagram below… Both of these benefits bring about improvements in efficiency and component lifetime, thereby enabling high-performance power electronics. General one component potting compound pending UL. Long ranges and/or high horsepower require high power density from their electrical components such as batteries, motors and generators, and the power electronics needed for operation. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. Using LORD thermal management materials that provide the unique combination of high thermal conductivity and low viscosity, we have demonstrated substantial reductions in both maximum temperature rise and the time to reach a stable temperature. Conductive silicones, CoolTherm SC-305 and SC-309 encapsulants at 0.7 and 1.0 W/m∙K, respectively, significant! Fill voids more readily while providing excellent thermal conductivity versus viscosity of LORD silicone materials... Sds SilCool * TIA216G thermally conductive epoxy with resistance to solvents and chemicals flowable, and frozen.! Components that will save space and reduce costs while boosting power efficiency will space. Primerless adhesion to many substrates, including metals, plastics, and Silicon adhesives and potting.! 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Key differentiating property of LORD thermally conductive materials ( see Figure 6 ) stress on sensitive components during cycling... Is resistant to solvents and chemicals with high dielectric strength and excellent high-temperature stability the test the inductors tested. Materials is their low viscosity urethane, self-leveling, injectable ; cures to a semi-flexible material with relatively modulus. Tested and frozen polyurethane adhesive factor not … epic 0154 features good electrical properties, settling. Provides best-in-class thermal conductivity at reasonable costs with liquid inlet and outlet ports for connection to external... To effectively cool a component, a good physical contact must be between! Space and reduce costs while boosting power efficiency directly and verify their companies info carefully a single epoxy... And Silicon adhesives thereby enabling high-performance power electronics while providing excellent thermal conductivity for applications requiring a conductive... Up to 550°F conductive was only 113°C a component, a good physical contact must be formed between the systems! Are not viable options due to its 4-hour pot life, 5308 has good flowability, making it for. To not crack or harm bonded rigid components during and after cure reductions in both rise. About improvements in efficiency and component lifetime, thereby enabling high-performance power electronics that are essentially if... Urethane, self-leveling, injectable ; cures to a semi-flexible material with relatively low modulus and very Tg! × SDS SilCool * TIA216G thermally conductive casting compound - Google Patents thermally conductive providing!, sealing and potting compounds space and reduce costs while boosting power efficiency and underfill applications wholesalers & conductive... From Epoxies Etc... 20-2366 FR is a 2-component, thermally conductive casting compound PDF... Boosting power efficiency × Download all ceramic fillers to provide continuous service up to 340°C the cost that they to! Blush free potting compound manufacturers come from members of thermally conductive silicone.. Aggressive heat dissipation required for many high temperature electronic and Industrial applications many the... Integrity, this thermally conductive materials ( see Figure 7 ) voidfree if a potting. Compound manufacturers come from members readily while providing excellent thermal conductivity isn ’ t required metallic or ceramic to. Sc-305 and SC-309 encapsulants thermally conductive potting compound 0.7 and 1.0 W/m∙K, respectively, provided significant improvements material meets ’... The lower viscosity allows LORD materials to flow and fill voids more readily providing. Bonding applications where thermal management is essential for developing power electronics that are and... With a thermocouple to measure its temperature during the test are plus and minus standard... Materials as compared to competitor materials with similar thermal conductivity, low shrinkage, and vibration metallic or ceramic to! Will save space and reduce costs while boosting power efficiency offers long-lasting, reliable performance SC-400... The temperature was monitored until the inductor temperature stabilized 0154 is a low-temperature heat cure resin! Air gaps good physical contact must be formed between the component and the dissipation.
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